Application Note: Current Connections
Soldering example courtesy of Y. Miyamoto, SEA
In the mid 15th century a scholar by the name of Lorenzo Valla discovered that the document giving the Roman Pope authority over Europe was a fake. Fortunately, he was able to survive this revelation by having good connections in the Vatican. His friend, Cardinal Nicholas of Cusa, was a current favorite of the Pope. Nicholas, who died in 1464, promoted more than his friend Lorenzo. He suggested that the earth wasn't at the center of the universe (before Copernicus), that experimental methods should be used to determine the speed of objects in air (before Galileo), and that motion was relative (before Mach and Einstein).
If Nicholas had known about electricity, he might have further solidified his reputation by suggesting ways to connect current carrying elements. Today's demand for smaller, more powerful electric devices has created a need for better ways to make solder connections. Solder is a low melting point material that can be make to wet the surface of the materials to be joined.
Fluid simulation offers accompanying figure is an example of dip soldering in which two pins to be soldered together have been dipped in a pool of molten solder. This approach without resulting in unwanted connections. The amount of solder making a connection can also be determined as a function of such process parameters as the initial temperature, surface tension coefficient of the solder, adhesion properties of the pins, and dip speed.
Everyone understands the importance of good connections and certainly everyone knows the consequences of having bad ones. For example, when Galileo lost his connection to Pope Urban VIII he was put on trial for heresy. Fortunately for us, Galileo's legacy remains current today. To avoid losing your connections, consider how FLOW-3D could be your supporter.