FLOW-3D ThermoSET Validation
As demand for higher performance increases, the number of parts that are packed into electronic modules has increased dramatically. This tends to make the configuration of inserted parts much more complex. Meanwhile, the products in which such modules are used are becoming smaller and smaller, increasing the push towards miniaturization of such modules. These trends complicate the flow of molten thermosetting compounds in the mold cavity, making the prediction of void formation and deformation of the very-thin gold wires used to connect integration chips to substrates much more difficult.
FLOW-3D ThermoSET is designed specifically to solve such complex problems. FLOW-3D ThermoSET incorporates an empirical model for calculating viscosity changes associated with a chemical reaction and includes a non-dimensional relationship for time and viscosity. FLOW-3D ThermoSET also contains a model for predicting deformation gold wires which was derived from a combination of empirical data and theoretical viscosity values for several semiconductor devices.
Modeling the Filling of a Semiconductor Device
In this case, FLOW-3D ThermoSET was used to analyze the flow of a commercial epoxy compound into the mold of an in-production high performance electronic module. The changes in the three-dimensional distributions of parameters such as temperature, viscosity, velocity, and pressure were compared with the observed flow front patterns.
As seen in the images presented on this page, the predicted results of cavity filling behavior correspond very well with short shot data. The predicted amount of gold-wire deformation also correspond well with observed data obtained by X-ray inspection.