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Thermosetting Resin CFD Modeling Software
FLOW-3D ThermoSET is the first CAE package aimed specifically at solving the complex and unique problems surrounding the development and production of products using thermosetting resins. These materials, with their high adhesive and structural strength and thermal and chemical durability, are used in semiconductor devices, generators, transformers and switches, coils and other components for electric vehicles and hybrid electric vehicles, printed circuit boards, and MRIs. However, they also present unique issues and problems in the production processes used to put the materials to use.
Working in cooperation with Hitachi and Terrabyte Corporation, Flow Science can now offer engineers seeking to tackle these most challenging problems a high level tool to produce accurate predictions of void formations, incomplete filling, overfilling, and gold wire deformations. FLOW-3D ThermoSET has been used in the electronics industry in Japan for over 5 years with great success.
FLOW-3D ThermoSET Webinars
An Introduction to FLOW-3D ThermoSET v5.0
Simulating Crosslinked Polymers
Learn about modeling crosslinked polymers using FLOW-3D ThermoSET, the first CAE software that simulates complex thermosetting resins. View a FLOW-3D webinar on-demand.
Related links:
Read the FLOW-3D ThermoSET press release
Download the FLOW-3D ThermoSET brochure (pdf)
Learn how you can purchase FLOW-3D ThermoSET
See how Hitachi uses FLOW-3D
Analysis of a Thermosetting Compound During Mold Filling
Three types of viscosity models are available in
FLOW-3D ThermoSET: a Time and Temperature model,
where viscosity is expressed as a function of temperature
and time; a Temperature and Reactive Rate model,
where viscosity is expressed as a function of temperature
and reactive rate; and the Macosko model (screenshot from
GUI shown above), which expresses viscosity as a function
of temperature, shearing speed and reactive rate.
FLOW-3D ThermoSET allows engineers to predict the
deformation of gold wires during filling.
FLOW-3D ThermoSET Advantages
FLOW-3D ThermoSET consists of a custom FLOW-3D solver designed to model the flow and thermal characteristics of thermosetting resins in fast, accurate simulations and a specialized user interface designed to provide:
- Fast and cost-effective data fitting for thermosetting resins
- Automatic setup for FLOW-3D ThermoSET simulations
- Prediction of gold wire deformation
- Output to structural analysis codes
FLOW-3D ThermoSET Validation >
Applications for FLOW-3D ThermoSET:
- Resin encapsulated devices such as semiconductors, memory devices, diode devices, electronic modules for automobiles, ignition parts, sensor parts and more, using the molding, potting, under filling, and die bonding processes.
- Encapsulation of motor coils, generator coils, MRI coils, and superconducting coils using molding and resin transfer molding.
- Heavy electrical transformers and circuit breaker
- Casks for storage and transport of radioactive used nuclear fuel
- Anisotropic conductive film and non conductive film